The leadframe is a thin metal plate part to be used in semiconductor packages such as IC, LSI, etc.
While it supports and fixes an IC chip, its other role is to function as connection pins when the chip is mounted on a printed wiring board.
The leadframe maximizes chip performance, such as the heat-diffusing function, and enables it to be operated for long periods of time.
By fully utilizing its advanced etching technologies that have long been, TOPPAN Inc. is actively developing a variety of leadframes while foreseeing such market trends.
Fine Pitch Leadframe
Smaller packages can be materialized by reducing gaps between inner lead tips.
Leadframes with these fine pitches enable the reduction of gold wire consumption and enhance their reliability.
Downset leadframes that employ challenging fabrication technologies including bus bar, power ring, leaping, etc. contribute to improved performance as well as to the replacement of BGA to leadframes.
Leadframe with Heat Spreader
This is the leadframe combined with a heat spreader, enabling finer pitch.
By applying the blackening treatment or roughening treatment, adhesion to the mold resin can be improved.
Resin Adhesion Improved Package
Roughening treatment (micro etching) helps to improve resin adhesion. This technology has been adopted for semiconductor packages for automobiles that require much greater reliability.
This is a heat radiation type leadframe that is best for power semiconductors and others that require highly effective heat radiation. Heat spreaders are fixed on the leadframe by the caulking method.
This is a type of substrates for QFN (Flat Non-leader Package) corresponding to the demand for smaller semiconductor packages. It meets market demand with its high precision etching technology.