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TOPPAN
Electronics Division

Next-Generation
package substrate

TOPPAN

Organic RDLs
by damascene processing

In addition to the microfabrication technology nurtured in our FC-BGA bussiness, by newly utilizing the damascene wiring formation stemmed from the semiconductor front-end process, TOPPAN works on the development of chip-last type organic RDLs.

Overview

Structure

Structure

  • Cross-section SEM image

  • Target Specifications

Mounting process

  • RDL
    (wiring layer)

  • Mount an RDL with carrier on
    an FC-BGA substrate

  • →↓

  • After RDL
    mounting

  • →↓

  • Removal of
    glass carrier

  • →↓

  • Chip
    mounting

Glass substrate

By leveraging our glass processing technology cultivated for many years, we have succeeded in developing glass substrates having TGV together with cavities of different depths. We aim to develop next-generation semiconductor packaging of a combination with FC-BGA substrate.

Overview

Structure

Structure

Processing examples

Structure

Application examples

  • Glass-core FC-BGA substrate

  • Glass Interposer

Core-less organic interposer

TOPPAN RDL Embedded Coreless Substrate (T-RECS) is a coreless-structure organic interposer that allows mounting of multiple heterogeneous chips (heterogeneous integration) contributing to high functionality of next-generation semiconductors.

Overview

Structure

Structure

Features

  • Separating the interposer from the carrier during the manufacturing process makes standalone electrical inspection assurance possible, enhancing reliability and enabling supply as a known-good substrate.
  • The CTE is approximately 45% lower than conventional packaging substrates, making it possible to prevent cracks that arise due to differences between the CTEs of FC-BGA substrates and RDLs.
  • The narrow pitch mold resin through-mold via (TMV) structure enables fine routing/fine interconnection with a minimum connection terminal pitch of 40μm (conventionally 130μm) on the chip side and 130μm (conventionally 300μm) on the substrate side.
  • Due to the scalability of panel level manufacturing, large sizes of more than 100 mm sq. can be supported.

  • Cross-section SEM image

    Reinforce RDLs (L/S=2/2 um) using organic insulating resin
    with low CTE and high elasticity (EMC, laminates).

  • Target Specifications

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