1. HOME
  2. Device development
  3. Power semiconductor turnkey service

Power semiconductor turnkey service

We provide turnkey services of power semiconductors where it is difficult to secure wafer manufacturing capacity, for example automotive, industrial equipment, factory automation, and other applications.
In addition to total solution services from design to packaging and mass production, we can also undertake wafer manufacturing.
We also offer porting of wafer manufacturing processes owned by device manufacturers and contract services for partial processing.
Using this service enables a stable supply of a wide variety of small-lot products.

Features

Schemes for our turnkey service

  • design :
    Clients, TOPPAN Technical Design Center
  • Layout design :
    TOPPAN Technical Design Center
  • Wafer manufacturing :
    Power semiconductor foundries in Japan (JS Foundry KK., etc.)
  • Packaging and Assembly, Testing and Evaluation :
    OSAT

TOPPAN's strengths

  • Product development tailored to customers' needs, such as high-mix low-volume production and support for EOL.
  • Can provide a total solution from design, manufacturing to packaging and testing.
  • Stably-secured production capacity.
  • Production system supported mainly by domestic foundries and OSATs in Japan.

Contract manufacturing lineup

  • The lineup of IGBTs covers the 5th generation products (trench-type / FS-type) which are the market-leading products.
    RC-type IGBTs equipped with FWD are also available.
  • MOSFET supporting up to 1700V (both planar-type and trench type are available.)

  • Si Power Devices

    • FS-IGBTs (5th generation)
    • RC-IGBTs (derivatives of FS-IGBTs)
    • FRDs
    • High Voltage MOSFETs

  • SiC Power Devices

    • SBD 1200V/600V

  • Packages

    • mass production : TO-220, TO-247
    • prototyping : TO-264

Power Semiconductor Porting Service

This is a service that undertakes process porting and partial processing of power semiconductors.
We can meet a wide range of customer needs, including porting processes owned by customers or semiconductor manufacturers, and partial processing related to wafer manufacturing, such as epitaxial and backside processes.

Porting capability

  • IGBT, RC-IGBT, FRD, Power MOSFET and similar devices

Can accept consignment of each partial processing

  • 6inch wafer
    Front-end processes such as epitaxy, Oxidation, Diffusion, CVD, CMP, Lithography and Etching
  • 6inch wafer / 8inch wafer
    Silicon wafer grinding (Back grinding, TAIKO process), Backside metallization, Plating, Testing, Backside etching, Backside ion implantation, Backside sputtering, and Laser annealing
  • 8inch wafer
    Bumping, WL-CSP

Device development