Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards.
Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile. TOPPAN Inc. has been developing and manufacturing various types of semiconductor packaging materials including leadframes, and FC-BGA substrates by utilizing the cutting-edge photolithography and etching technology, Toppan's group long-established advantages.