What is a semiconductor package substrate?
Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards.
Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile. TOPPAN Inc. has been developing and manufacturing various types of semiconductor packaging materials including leadframes, and FC-BGA substrates by utilizing the cutting-edge photolithography and etching technology, Toppan's group long-established advantages.
Line- up and Structure of Products
TOPPAN Inc. offers several types of semiconductor package-related products.
Progress of Semiconductor Packages
Semiconductor packages require 3 points: 1. smaller packaging with high density; 2. high pin-count for high integration with multiple functions; 3. high heat-dissipation characteristics and high electric properties enabling high performance. TOPPAN Inc. offers wide range of products required by constantly evolving needs in the semiconductor packaging market.